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MEMS Differential Pressure Sensor Wafer with Pressure Range 0~±5kPa/±35kPa/±100kPa
NSP1832 series MEMS differential pressure sensor wafer is mainly made via the piezoresistive effect of silicon with NOVOSENSE independent R&D MEMS micro machining process design. The sensor wafer manufacturing platform is qualified by IATF16949, and the front/back side of every wafer pass AOI tested which compiles with AEC-Q103 standards. NOVOSENSE also launched unique precious metal differential pressure MEMS series products, which mainly adopts precious metal double-pad structure design and stability enhanced shielding layer technology, and specially used in automotive exhaust system and other harsh environment.
Product Features
• Operating temperature range: -40℃~150℃
• Pressure range: 0kPa~±5kPa/±35kPa/±100kPa
• The accuracy and stability in the life cycle are better than 1%F.S.
• Automotive-qualified IATF16949-certified process platform
• Comply with RoHS & REACH and halogen-free requirements
• Compiles with AEC-Q103 standard
• Single chip size: 1.65mmx1.65mmx0.4mm
Application
• Automotive: FTPS fuel steam pressure detection, GPF/DPF exhaust differential pressure detection, VBS vacuum boosting system sensor, EGR system differential pressure detection, Crankcase ventilation pressure sensor
• Industrial: fire residual pressure monitoring, HVAC/VAV, pressure transmitter, pressure switch, negative pressure vacuum detection, gas flow monitoring
• Medical: ventilator, sphygmomanometer, oxygen generator, anesthesia apparatus, biosafety cabinet
• Home appliances: washing machine, dishwasher, coffee machine, vacuum cleaner, water purifier, vacuum juicer, etc.
• Consumption: air mattress, massage chair, air pump etc.
Functional Block Diagram
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